International  Academic Conference on Computer Architecture, Microprocessors and Very-Large-Scale Integration 2027 (CAVLSI 2027)

April 20th-22nd, 2027Shijiazhuang

REGISTRATION

Welcome to CAVLSI 2027

The conference, scheduled for April 20th–22nd, 2027, in Shijiazhuang, China, will focus on the latest research in the field of “Computer Architecture, Microprocessors and Very-Large-Scale Integration”. The conference will cover “Computer Architecture, Microprocessors and VLSI.” It aims to provide a high-level platform for researchers and scholars to showcase and exchange their research findings. Through keynote speeches, oral presentations, and poster displays, the conference will highlight the latest technological advancements and achievements, fostering technical exchanges and intellectual collisions. We sincerely invite experts, scholars, and professionals from universities, research institutions, and the business community, as well as other relevant individuals, to actively participate and engage in the exchange.

CALL FOR PAPERS

All papers related to the themes of Computer Architecture, Microprocessors and Very-Large-Scale Integration etc. can be submitted, including but not limited to the following topics:

Computer Architecture

Design and Optimization of General-Purpose Computing Architectures

Domain-Specific Architectures and Accelerator Design

Memory Systems and Processing-in-Memory Architectures

Multicore and Parallel Computing Architecture Technologies

Low-Power and High-Reliability Architecture Design

Architectural Security and Trusted Computing Technologies

Microprocessors

Design and Implementation of General-Purpose Microprocessors

Design of Application-Specific and Embedded Processors

Functional Verification and Testing of Microprocessors

Low-Power and Energy-Efficiency Optimization for Microprocessors

Reliability and Resilient Design Techniques for Microprocessors

Design and Application of Open-Source Instruction Set Processors

Very Large Scale Integration (VLSI)

Front-End Design and Implementation for VLSI Circuits

Back-End Design and Physical Implementation for VLSI Circuits

Integrated Circuit Fabrication and Micro/Nano Processing Technologies

Integrated Circuit Packaging and System Integration Technologies

Integrated Circuit Packaging and System Integration Technologies

Design of Mixed-Signal and Optoelectronic Integrated Circuits

PUBLICATION

The full text of each submitted paper will undergo three technical reviews, which include initial review, double-blind peer review (at least three review experts), and final review. The submission will be evaluated on the originality of the content, technical and research content/depth, correctness, relevance to the conference, contribution and readability.

Announcements

ORGANIZER

北京中环电力能源大数据研究院.jpg

Beijing Zhonghuan Institute of Electric Power and Energy Big Data

International-Association-for-Energy-and-Environmental-Research.jpg

International Association For Energy And Environmental Research